Three dimensional structure and its manufacturing method

ABSTRACT

A plurality of micro three-dimensional structure elements each having a movable structure fixed on a sacrifice layer, and fixation portions of the micro three-dimensional structure elements for the sacrifice layer are arranged into a film-like elastic body, and then the sacrifice layer is removed. Thus, a three-dimensional structure in which the individual micro three-dimensional structure elements are arranged independently of one another within the elastic body is manufactured.

CROSS REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. application Ser. No.11/654,658, filed on Jan. 18, 2007, the entirety of which isincorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a structure, as well as itsmanufacturing method, formed three-dimensionally by using MEMS (MicroElectro Mechanical Systems) technology or NEMS (Nano Electro MechanicalSystems) technology. In particular, the invention relates to athree-dimensional structure, as well as its manufacturing method, inwhich micro three-dimensional structure elements having a movablestructure are arranged in an elastic body.

2. Description of the Related Art

In the research and development of robot technology, it is one ofimportant issues how an object is reliably controlled by a robot hand.More specifically, with respect to an operation of grasping an object bya robot hand, not only detecting grasping force to grasp the objecttherewith but also detecting a shearing stress occurring to the handsurface due to the grasping operation is needed for reliable control ofrobot hands. The reason of this is that detecting a frictional forcegenerated between the object and the hand surface by the shearing stresslends it exerting optimum frictional-force control to fulfill reliablecontrol of the object.

In recent years, tactile sensors aimed at detecting such shearing stresshave been being developed. See, e.g., Kentaro Noda, Kazunori Hoshino,Kiyoshi Matsumoto, Isao Shimoyama, “300 nm-thick cantilevers in PDMS fortactile sensing”, Proc. IEEE MEMS'05, pp. 283-286, 2005. An example ofsuch conventional tactile sensors is explained below with reference to aschematic perspective view shown in FIG. 19.

As shown in FIG. 19, a tactile sensor 501 includes a plurality ofpiezoresistive cantilevers 502, which are cantilevers withpiezoresistors on its hinges, formed from a thin film of about severalhundred nanometers, one sheet of substrate member 503 on which thosecantilevers 502 are fixed at its top face, and a film-like elastic body504 which is placed inside the substrate member 503 so as to allow thecantilevers, which are fixed on the top face of the substrate member503, to be embedded therein.

Each of the cantilevers 502 has one end formed as a fixation portion forthe substrate member 503 and the other end formed as a movable portionwhich is movable only in a thicknesswise direction of the thin film thatforms the cantilever 502. The individual cantilevers 502 areelectrically connected to an unshown control unit through unshownterminal portions and wiring. For example, upon occurrence of a shearingstress in the film-like elastic body 504, the shearing stress causes themovable portion of the cantilever 502 to be activated and deformed, thusmaking possible to detect the shearing stress. In each of thecantilevers 502, a piezoresistive portion for detecting any deformationof the movable portion is formed. Further, in order to detect shearingstresses of various directions acting on the film-like elastic body 504,the cantilevers 502 are arranged within the film-like elastic body 504,as it is fixed on the substrate member 503, so that their movableportions are differed in movable direction, for example, that theirmovable directions are set along X-axis, Y-axis and Z-axis directions asshown in the figure.

With the tactile sensor 501 constructed as shown above, contact of thefilm-like elastic body 504 with an object or the like makes it possibleto detect shearing stresses in various directions occurring within thefilm-like elastic body 504 by the cantilevers 502, respectively. It isnoted that such a film-like elastic body 504 is formed from, forexample, PDMS (polydimethylsiloxane), which is a material that is easilyelastically deformed by application of external force. The substratemember 503 is given by using SOI wafer, which is formed of Si or SiO₂.

SUMMARY OF THE INVENTION

The tactile sensor 501 having such a conventional structure as describedabove is formed through the steps of two-dimensionally forming eachcantilever 502 as a thin-film member on an SOI wafer that is to becomethe substrate member 503, then forming a cantilever structure by etchingor other process, thereafter performing such processes as erecting thecantilever structure by using a magnetic field or other force or method,and finally making the cantilever structure embedded in the film-likeelastic body 504 that is formed from PDMS. Accordingly, in the statethat the structure is embedded within the film-like elastic body 504,the substrate member 503, to which the individual cantilevers 502 arefixedly placed, is inevitably present.

When such a tactile sensor 501 is set for use on a curved surface suchas a surface of a robot hand, the presence of the substrate member 503,which is a hard material, gives limitations of the use such as theplacement of the tactile sensor 501 on curved-surface portions.

Therefore, an object of the present invention, lying in solving theseand other issues, is to provide a three-dimensional structure, as wellas its manufacturing method, in which micro three-dimensional structureelements each having a movable structure formed by using the MEMStechnology or NEMS technology are placed within a film-like elasticbody, the three-dimensional structure being capable of effectivelyutilizing the flexibility of the film-like elastic body while theoperation of the movable structure is improved in smoothness.

In accomplishing the above object, the present invention has the followconstitutions.

According to a first aspect of the present invention, there is provideda three-dimensional structure comprising:

a plurality of micro three-dimensional structure elements each having amovable structure; and

a film-like elastic body in which said individual microthree-dimensional structure elements are arranged independently of oneanother.

According to a second aspect of the present invention, there is providedthe three-dimensional structure as defined in the first aspect, whereineach of said micro three-dimensional structure elements has an externalforce detection function for detecting operation of the movablestructure based on elastic deformation generated in said film-likeelastic body by action of an external force.

According to a third aspect of the present invention, there is providedthe three-dimensional structure as defined in the first aspect, whereineach of said micro three-dimensional structure elements has an externalforce transfer function for operating the movable structure to transferan external force to its surrounding film-like elastic body so that saidfilm-like elastic body is elastically deformed.

According to a fourth aspect of the present invention, there is providedthe three-dimensional structure as defined in the first aspect, whereineach of said micro three-dimensional structure elements is arranged sothat its whole outer periphery is covered with said film-like elasticbody.

According to a fifth aspect of the present invention, there is providedthe three-dimensional structure as defined in the first aspect, whereineach of said micro three-dimensional structure elements is so structuredas to be movable in one movable direction, and

said micro three-dimensional structure elements are so arrangedindependently of one another that the movable direction of one of saidmicro three-dimensional structure elements and the movable direction ofanother one of said micro three-dimensional structure elements aredifferent from each other.

According to a sixth aspect of the present invention, there is provideda three-dimensional structure comprising:

a plurality of micro three-dimensional structure element groups in eachof which a plurality of micro three-dimensional structure elements arecoupled to one another by a coupling member, and

a film-like elastic body in which said micro three-dimensional structureelement groups are arranged independently of one another.

According to a seventh aspect of the present invention, there isprovided the three-dimensional structure as defined in the sixth aspect,wherein in each of said micro three-dimensional structure elementgroups, the coupling member is formed from an elastic material having amodulus of elasticity higher than a modulus of elasticity of saidfilm-like elastic body.

According to an eighth aspect of the present invention, there isprovided a three-dimensional structure manufacturing method comprising:

arranging, into a film-like elastic body, a plurality of microthree-dimensional structure elements each having a movable structurefixed on a sacrifice layer, and fixation portions of said microthree-dimensional structure elements fixed to said sacrifice layers; and

removing said sacrifice layers so that said micro three-dimensionalstructure elements are arranged independently of one another within saidfilm-like elastic body.

According to a ninth aspect of the present invention, there is providedthe three-dimensional structure manufacturing method as defined in theeighth aspect, wherein

the arrangement of said individual micro three-dimensional structureelements into said film-like elastic body is fulfilled by arranging aplurality of micro three-dimensional structure element groups, in eachof which said plurality of micro three-dimensional structure elementsare coupled to one another by a coupling member, and said individualfixation portions of said sacrifice layers, at which said individualmicro three-dimensional structure element groups are fixed to saidsacrifice layers, into said film-like elastic body, and

then said sacrifice layers are removed, by which said individual microthree-dimensional structure element groups are arranged independently ofone another into said film-like elastic body.

According to a tenth aspect of the present invention, there is providedthe three-dimensional structure manufacturing method as defined in theeighth aspect, further comprising:

after the removal of the sacrifice layers, placing an elastic body,which is formed from the same material as that of said film-like elasticbody, at portions of said film-like elastic body where said sacrificelayers have been removed.

According to an eleventh aspect of the present invention, there isprovided the three-dimensional structure manufacturing method as definedin the eighth aspect, wherein said individual micro three-dimensionalstructure elements are arranged into said film-like elastic body so thatat least parts of said sacrifice layers are exposed from a surface ofsaid film-like elastic body.

According to a twelfth aspect of the present invention, there isprovided the three-dimensional structure manufacturing method as definedin the eighth aspect, wherein the arrangement of said individual microthree-dimensional structure elements into said film-like elastic body isfulfilled by arranging, into said film-like elastic body that is in afluidizable state, said individual micro three-dimensional structureelements and said fixation portions to said sacrifice layers, and thencuring the elastic body in the resulting arrangement state.

According to a thirteenth aspect of the present invention, there isprovided the three-dimensional structure manufacturing method as definedin the eighth aspect, wherein said sacrifice layers are formed of Si orSiO₂.

According to a fourteenth aspect of the present invention, there isprovided the three-dimensional structure manufacturing method as definedin the eighth aspect, wherein said individual micro three-dimensionalstructure elements formed on said sacrifice layer having acurved-surface configuration or a multifaceted-surface configuration arearranged into said film-like elastic body having a curved-surfaceconfiguration or a multifaceted-surface configuration.

According to a fifteenth aspect of the present invention, there isprovided the three-dimensional structure manufacturing method as definedin the eighth aspect, further comprising:

after the removal of the sacrifice layers, placing a flexible substrateformed from an elastic material on a surface of said film-like elasticbody on one side on which said sacrifice layers have been removed.

According to a sixteenth aspect of the present invention, there isprovided the three-dimensional structure manufacturing method as definedin the tenth aspect, further comprising:

after the placement of the elastic body at the removal portions of thesacrifice layer, placing a flexible substrate formed from an elasticmaterial on a surface of said film-like elastic body on one side thereofon which said elastic body has been placed.

According to the present invention, the three-dimensional structure ismanufactured by the steps of setting a plurality of microthree-dimensional structure elements, which are formed on a relativelyhard sacrifice layer of Si or SiO₂ or the like, into a placement withina film-like elastic body, and thereafter removing the sacrifice layer.Therefore, in this three-dimensional structure, the individual microthree-dimensional structure elements can be set so as to be arrangedphysically independently of one another. In such a structure, externalforce applied to the film-like elastic body can be transferredindependently and securely to the individual micro three-dimensionalstructure elements without impairing the flexibility of the film-likeelastic body, or force can securely be transferred from the individualmicro three-dimensional structure elements to their peripheral film-likeelastic body. Thus, there can be provided a three-dimensional structurecapable of effectively utilizing the functions of the film-like elasticbody having flexibility.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other aspects and features of the present invention willbecome clear from the following description taken in conjunction withthe preferred embodiments thereof with reference to the accompanyingdrawings, in which:

FIG. 1 is a schematic perspective view showing a construction of atactile sensor according to a first embodiment of the present invention;

FIG. 2 is a schematic explanatory view for explaining an external forcedetection function of the tactile sensor of FIG. 1;

FIG. 3A is a schematic sectional view for explaining a manufacturingmethod of the cantilever included in the tactile sensor of FIG. 1,showing a state that a piezoresistive layer is formed on an SOI wafer;

FIG. 3B is a schematic explanatory view for explaining the cantilevermanufacturing method, showing a state that a Cr/Ni layer has beenformed;

FIG. 3C is a schematic explanatory view for explaining the cantilevermanufacturing method, showing a state that the Cr/Ni layer has beenpartly removed;

FIG. 3D is a schematic explanatory view for explaining the cantilevermanufacturing method, showing a state that a basic structure of thecantilever has been completed;

FIG. 4 is a schematic top view of the cantilever of FIG. 3D;

FIG. 5 is a flowchart showing the procedure in the manufacturing methodof the tactile sensor of FIG. 1;

FIG. 6 is a schematic sectional view for explaining the manufacturingmethod of the tactile sensor, showing an SOI wafer on which cantileversare formed;

FIG. 7 is a schematic sectional view for explaining the manufacturingmethod of the tactile sensor, showing a state that the SOI wafer isplaced within a container with magnetic fields imparted thereto;

FIG. 8 is a schematic sectional view for explaining the manufacturingmethod of the tactile sensor, showing a state that PDMS is beinginjected into the container;

FIG. 9 is a schematic sectional view for explaining the manufacturingmethod of the tactile sensor, showing a state that a Si lower-layer anda SiO₂ layer have been removed;

FIG. 10 is a schematic sectional view for explaining the manufacturingmethod of the tactile sensor, showing a state that PDMS is beingresupplied into recessed portions;

FIG. 11 is a schematic perspective view showing a three-dimensionalstructure set in a curved-surface configuration according to amodification of the first embodiment;

FIG. 12 is a schematic perspective view showing a three-dimensionalstructure with a base material placed therein according to anothermodification of the first embodiment;

FIG. 13 is a schematic perspective view showing a cantilever wiringstructure in a tactile sensor according to a modification of the firstembodiment;

FIG. 14 is a schematic sectional view taken along the line B-B in thetactile sensor of FIG. 13;

FIG. 15 is a schematic sectional view showing a cantilever wiringstructure in a tactile sensor according to another modification of thefirst embodiment;

FIG. 16 is a schematic perspective view showing a relative motionprevention structure of the cantilevers in a tactile sensor according toa modification of the first embodiment;

FIG. 17 is a schematic sectional view taken along the line C-C in thetactile sensor of FIG. 16;

FIG. 18 is a schematic perspective view showing the construction of atactile sensor according to a second embodiment of the invention;

FIG. 19 is a schematic perspective view showing the construction of aconventional tactile sensor;

FIG. 20 is a schematic top view of a cantilever according to amodification of the first embodiment;

FIG. 21 is a schematic sectional view taken along the line D-D in thecantilever of FIG. 20;

FIG. 22 is a schematic view showing a state that the cantilever of FIG.1 is placed on a neutral axis of a film-like elastic body; and

FIG. 23 is a schematic view showing a construction of a tactile sensoraccording to a modification of the first embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Before the description of the present invention proceeds, it is to benoted that like parts are designated by like reference numeralsthroughout the accompanying drawings.

Hereinbelow, embodiments of the present invention will be described indetail with reference to the accompanying drawings.

First Embodiment

FIG. 1 is a schematic perspective view showing a schematic structure ofa tactile sensor 1 (or tactile sensor structure 1) which is an exampleof a three-dimensional structure according to a first embodiment of thepresent invention.

As shown in FIG. 1, the tactile sensor 1 of the first embodiment has aconstruction that a plurality of cantilevers 2, which are an example ofthe micro three-dimensional structure element having a movablestructure, are arranged independently of one another within a film-likeelastic body 3. That is, in this construction, the individualcantilevers 2 are embedded in the film-like elastic body 3, with theirwhole peripheries covered with the film-like elastic body 3, withoutbeing coupled to one another by any other member such as a substratemember.

As shown in FIG. 2, which is a schematic explanatory view of the tactilesensor 1, each of the cantilevers 2 is formed into a thin film shapehaving a thickness of, for example, about several hundred nanometers, soas to have a movable structure with one end (fixed end) given by afixation portion 2 b and the other end (free end) given by a movableportion 2 a, i.e., a cantilever structure. The cantilever 2 is so formedthat its thickness becomes thin enough with respect to its widthwisedirection, thus the movable portion 2 a being movable in thethicknesswise direction with respect to the fixation portion 2 b.Further, each cantilever 2 has a hinge portion 2 c which is an exampleof a connecting portion that connects the movable portion 2 a and thefixation portion 2 b to each other so that deformation of the connectingportion causes the movable portion 2 a to operate. In this hinge portion2 c, a piezoresistive portion for electrically detecting an operatingangle of the movable portion 2 a is provided.

Also, as shown in FIG. 1, the tactile sensor 1 includes three types ofcantilevers 2 that differ in the movable direction of their movableportions 2 a from one another, for example, an X-axis directioncantilever 2X having a movable direction along the X-axis direction inthe figure, a Y-axis direction cantilever 2Y having a movable directionalong a Y-axis direction in the figure, and a Z-axis directioncantilever 2Z having a movable direction along a Z-axis direction in thefigure. In FIG. 1, the X-axis direction and the Y-axis direction aredirections which extend along the surface of the film-like elastic body3 and which are orthogonal to each other, and the Z-axis direction is adirection which is orthogonal to the X-axis and Y-axis directions.

The film-like elastic body 3 is formed from an elastic material which iselastically deformed by application of external force or the like andwhich has such flexibility that the elastic deformation causes themovable portion 2 a of the cantilever 2 to be operated (deformed). Assuch an elastic material, transparent or colored PDMS(polydimethylsiloxane) as an example is used. Also, the film-likeelastic body 3 has another function of protecting the individualcantilevers 2 from being damaged by direct contact with external objectsor the like, and therefore is formed into such a thickness as to coverthe entirety of each cantilever 2, e.g., a thickness of about 1 to 2 mmor less. In order that both flexibility and strength can be satisfied atthe same time while a later-described stress detection function of thecantilevers 2 is effectively achieved, it is more desirable that thefilm-like elastic body 3 be formed into a thickness of, for example,about 100 μm to 1 mm.

Moreover, although not shown in FIG. 1, a terminal portion is providedat the fixation portion 2 b in each cantilever 2. The terminal portionsare independently connected with wiring for electrical connection to thecontrol unit so that the operating angle of the movable portion 2 a ineach cantilever 2 can be detected electrically.

For the tactile sensor 1 having the construction shown above, a shearingstress or pressure generated inside the film-like elastic body 3 byapplication of external force to the film-like elastic body 3 can bedetected by operation and deformation of the movable portion 2 a of thecantilever 2 whose movable direction coincides with the direction inwhich the stress is generated. It is noted that the X-axis directioncantilever 2× and the Y-axis direction cantilever 2Y in FIG. 1 functionas sensors for detecting forces that are generated along the surface ofthe film-like elastic body 3, while the Z-axis direction cantilever 2Zfunctions as a sensor for detecting forces, or pressures, that aregenerated in the Z-axis direction in the film-like elastic body 3.

Here is given an explanation of the principle in which stress isdetected by such a cantilever 2 with reference to the schematicexplanatory view of the tactile sensor 1 shown in FIG. 2.

As shown in FIG. 2, in the tactile sensor 1, upon application of anexternal force that acts along the surface of the film-like elastic body3, a shearing stress τ is generated in the horizontal direction, causingthe film-like elastic body 3 to be elastically deformed, so that ashearing strain γ is generated in the horizontal direction. As a result,the cantilever 2 arranged within the film-like elastic body 3, themovable portion 2 a of which is distorted integrally with the film-likeelastic body 3, is deformed to an extent corresponding to the shearingstrain γ, i.e. elastically deformed, in its movable direction (e.g., inthe X-axis direction of the figure). Since such a shearing strain γ doesnot vary depending on the position of the film-like elastic body 3 inits thicknesswise direction but is kept uniform generally, so that thedeforming extent of the movable portion 2 a does not change depending onthe placement position of the cantilever 2 in the film-thicknessdirection within the film-like elastic body 3. From such a point ofview, the placement position of the cantilever 2 in the film-thicknessdirection can be set freely. However, taking into consideration that thefilm-like elastic body 3 itself is curved so as to be used in acurved-surface configuration, the cantilever 2 is preferably placed on aneutral axis N in the film-thickness direction that involves the leasteffects of the curve as shown in the schematic view of FIG. 22, andpreferably placed, for example, so that the fixation portion 2 b of thecantilever is positioned on the neutral axis N. Further, such placementon the neutral axis N allows the cantilever 2 to be reliably protected.

Meanwhile, the hinge portion 2 c of the cantilever 2 includes apiezoresistive portion. This piezoresistive portion has a function thatits electrical resistance value varies relative to the deformationamount of the movable portion 2 a, while correlations between suchdeformation amounts and resistance values are previously measured andinputted and stored as correlation data in the aforementioned unshowncontrol unit. Accordingly, detecting a resistance change of thepiezoresistive portion due to a deforming extent of the cantilever 2effectuated by the shearing strain γ caused in the film-like elasticbody 3 by the shearing stress τ allows the shearing stress τ generatedin the film-like elastic body 3 by an external-force action to bedetected. In addition, according to such a principle of stress detectionby detection of deforming extents of the movable portion 2 a, the raisedangle of the movable portion in the X-axis direction cantilever 2X andthe Y-axis direction cantilever 2Y for detecting forces acting along thesurface of the film-like elastic body 3 is preferably set to 90 degrees,while the raised angle of the movable portion in the Z-axis directioncantilever 2Z for detecting pressures is preferably set to 0 degrees.

Next, a manufacturing method for the tactile sensor 1 having suchfunctions shown above is explained below with reference to theaccompanying drawings. In the following description, the manufacturingmethod for the cantilevers 2 is first described with reference to FIGS.3A to 3D, which are schematic sectional views of only one cantilever 2.

First, as shown in FIG. 3A, with use of, for example, an SOI wafer 10composed of a 300 μm thick Si lower-layer 11, a 400 nm thick SiO₂ layer12 and a 290 nm thick Si upper-layer 13, an upper 100 nm portion in theSi upper-layer 13 is formed as a piezoresistive layer (portion) 14 byusing, for example, a rapid thermal diffusion method.

Further thereon, a Cr/Ni layer 15 is formed by sputtering and thenpatterned into a specified configuration. As shown in FIG. 3B, with theCr/Ni layer 15 used as a mask, the piezoresistive layer 14 and the Siupper-layer 13 are etched by DRIE (Deep Reactive Ion Etching) process.

Thereafter, as shown in FIG. 3C, for prevention of short-circuits of thepiezoresistive layer 14, the Cr/Ni layer 15, which is provided so as tocover a portion of the cantilever 2 corresponding to the hinge portionthat connects the fixation portion 2 b and the movable portion 2 a toeach other, is removed by etching.

Further thereafter, as shown in FIG. 3D, the Si lower-layer 11 is etchedby DRIE process from the rear face side of the SOI wafer 10, andmoreover the SiO₂ layer is etched by using HF (hydrofluoric acid) gas.Thus, a structural portion in the cantilever 2, which forms the movableportion 2 a, i.e. a free end, is made open from the Si lower-layer 11and the SiO₂ layer. Thus, the basic structure as the cantilever 2 iscompleted.

FIG. 4 shows a schematic top view of the cantilever 2 shown in FIG. 3D.As shown in FIG. 4, the cantilever 2 is formed into such dimensions, forexample, that a width d1 of its movable portion 2 a is 110 μm, a lengthd2 of a portion of the movable portion 2 a over which the Cr/Ni layer 15is formed is 300 μm, and a length d3 of the hinge portion 2 c betweenthe movable portion 2 a and the fixation portion 2 b is 150 μm, wherethe overall length of the cantilever 2 is 450 μm and its overall widthis 150 μm. Also, a thickness of the piezoresistive layer 14 is 100 nmand a thickness of the Cr/Ni layer 15 is 5 nm/150 nm. Further, as shownin FIG. 4, a terminal portion 4 for delivery of electric signals withthe external is formed at the fixation portion 2 b of the cantilever 2.Furthermore, at the hinge portion 2 c between the movable portion 2 aand the fixation portion 2 b, a hollow portion is provided as viewed ina plan view in the figure. In addition, a schematic sectional viewshowing a cross section by line A-A in FIG. 4 is shown in FIG. 3D. Bythe hinge portion 2 c being divided into two structural bodies so thatthe hollow portion can be provided as shown above, inclinations or otheroutputs given to the structural bodies, respectively, are canceled outwith outputs of their respective outputs of piezoresistive layers, thusmaking it possible to accurately detect an amount of deformation in onlyone direction in the cantilever 2. It is noted that the structuralbodies in such a hinge portion 2 c are each formed into a width of, forexample, 30 μm. It is noted here that the term “micro” in the microthree-dimensional structure element herein refers to, for example, sucha size of the three-dimensional structure element that even if aplurality of three-dimensional structure elements (i.e., cantilevers 2)are arranged within the film-like elastic body 3 formed at a thicknessof about 100 μm to 1 mm, there hardly occurs any substantial effect onthe flexibility of the film-like elastic body 3, where an example of thesize of the three-dimensional structure element is several hundred μm orless. Desirably, the cantilever 2 like this is formed into even smallersizes less than several hundred μm, according to the thickness size ofthe film-like elastic body 3, such that no substantial effect is givento its flexibility.

Next, a method for manufacturing the tactile sensor 1 by placing thosecantilevers 2 formed on the SOI wafer 10 as described above within thefilm-like elastic body 3 is explained concretely. The followingdescription is given, for an easier understanding thereof, on a casewhere two cantilevers 2 as an example are formed on the SOI wafer 10 andthese two cantilevers 2 are arranged within the film-like elastic body3. A flowchart showing the procedure of the manufacturing method isshown in FIG. 5, and schematic sectional views for explaining theindividual steps are further shown in FIGS. 6 to 10.

First, as shown in the schematic sectional view of FIG. 6, twocantilevers 2 are formed on the SOI wafer 10, where a wiring line 5 isconnected to the terminal portion 4 of each cantilever 2. Such an SOIwafer 10 is placed within a container 17 as it is supported by a spacer16 formed of PDMS, which is an example of elastic material (step S1 inthe flowchart of FIG. 5). In this case, the spacer 16 needs to have aheight larger than the length of the movable portion 2 a of thecantilever 2, the spacer 16 being, for example, 0.8 mm high. Also, theposition at which the SOI wafer 10 is supported by each spacer 16 is setto such a position as to prevent interference due to operation of themovable portion 2 a of each cantilever 2, as will be described later.

Then, at step S2 of FIG. 5, a magnetic field M is imparted to the spacein the container 17. By the magnetic field acting on the Cr/Ni layer 15formed at the movable portion 2 a of the cantilever 2 as shown above,for example, there occurs torque that presses each movable portion 2 adownward in the figure, so that each movable portion 2 a is deformeddown so as to be positioned generally vertically as shown in FIG. 7. Assuch a magnetic field M, a magnetic field having strength of, forexample, 350 mT is imparted.

In the state that the magnetic field M is imparted as shown above,parylene-C is deposited on the surface of the cantilever 2 as aposture-retaining and strength-reinforcing member, by which a parylenelayer 18 is formed all over the surface of the cantilever 2 (step S3).Such a parylene layer 18 has a function of retaining the deformationalposture of the cantilever 2 as well as the function of reinforcing thestrength of the cantilever 2. Therefore, even if the impartment of themagnetic field M into the space inside the container 17 is canceledafterwards (step S4), the cantilever 2 is maintained in a state that themovable portion 2 a is positioned generally vertically downward, andfurther the cantilever 2 can be protected from deformation or damage orthe like due to external force in the following manufacturing steps. Itis noted that the posture-retaining and strength-reinforcing member maybe given by using a nonconductive film that can be deposited by vacuumdeposition process. As such a nonconductive film, for example,parylene-C or parylene-N or the like may be used.

Next, as shown in FIG. 8, PDMS 19, which is a fluidized elasticmaterial, is injected into the container (step S5). The injection ofPDMS 19 is performed in such a manner that at least the individualcantilevers 2 and fixing portions of the SOI wafer 10 for thecantilevers 2 are immersed and embedded in the injected PDMS 19.Desirably, the injection is performed so that the top face of the SOIwafer 10 in the figure is exposed from the injected PDMS 19. Inaddition, control for the injection plane of the PDMS 19 in thecontainer 17 (control for its height position) is executed bycontrolling the embedded volume of the container 17 and the cantilevers2 and by controlling the injection amount of the PDMS 19. It is notedthat the impartment of the magnetic field in step S4 may also beexecuted subsequent to the foregoing step S5.

Thereafter, as the PDMS 19 injected into the container 17 is cured, theparylene layer 18 deposited on the surface of the SOI wafer 10 exposedfrom the PDMS 19 is partly removed (step S6). The partial removal of theparylene layer 18 like this is executed by, for example, O₂ plasmaetching process.

Next, DRIE etching process is performed from the top face of thecontainer 17, by which the Si lower-layer 11 of the SOI wafer 10 exposedfrom the PDMS 19 is removed. Thereafter, by executing etching processusing hydrofluoric acid (HF) gas, the SiO₂ layer 12 exposed as a resultof the removal of the Si lower-layer 11 is removed (step S7). As aresult, as shown in FIG. 9, fixing portions of the individualcantilevers 2 for the SOI wafer 10 are removed, resulting in a statethat respective recessed portions 20 are formed on the surface of thePDMS 19. Accordingly, by the removal of the SiO₂ layer 12 and the Silower-layer 11 that have fixed the cantilevers 2, the individualcantilevers 2 are arranged independently of each other in the PDMS 19.That is, in this manufacturing method, the SiO₂ layer 12 and the Silower-layer 11 in the SOI wafer 10 are layers which play the role assacrifice layers that are to be finally removed. In addition, theremoval of such sacrifice layers may also be done by XeF2 gas etching,other than DRIE etching.

Thereafter, as shown in FIG. 10, fluidized PDMS is injected into theindividual recessed portions 20 formed on the surface of the PDMS 19, bywhich the PDMS 19 is resupplied (step S8). After this resupply, theinjected PDMS 19 is cured, by which a film-like elastic body 3 formed ofPDMS is formed. It is noted that such a film-like elastic body 3 isformed into a thickness of, for example, 2 mm. Subsequently, thefilm-like elastic body 3 is taken out from the container 17 (step S9),by which a tactile sensor 1 having a structure that a plurality ofcantilevers 2 are arranged independently of one another in the film-likeelastic body 3 is completed. It is noted that the term, “arrangedindependently,” herein refers to a state that adjacent two cantilevers 2are placed so as to be physically separated from each other, where thosecantilevers 2 are arranged separately from each other so that, at least,one of the cantilevers 2 does not give a direct effect on the othercantilever 2.

The elastic material to be used for the injection to the individualrecessed portions 20 is preferably the same as the PDMS 19, which hasbeen the precedently injected elastic material. However, differentelastic materials may also be used if the elasticity of the film-likeelastic body 3, which is formed integrally therewith, is not affected.Such a concept is applicable also to the material of the spacer 16 incommon.

The above description on the manufacturing method has been made on acase where each cantilever 2 is embedded within the film-like elasticbody 3 by injection of the fluidized PDMS 19 into the container 17.However, the manufacturing method of the first embodiment is not limitedonly to such cases. Instead, for example, the individual cantilevers 2may also be embedded into PDMS by means of transferring PDMS to the SOIwafer 10 on which the individual cantilevers 2 have been formed. Also,after the cantilevers are individualized and cut into pieces from theSOI wafer 10 on which the individual cantilevers 2 have been formed,those cantilevers may be embedded in the film-like elastic body at adesired pitch. Using such a technique allows the pitch in themanufacture of cantilevers and the pitch in the embedding of thecantilevers to be different from each other, hence an effectivetechnique particularly when the embedding pitch is made wider than themanufacturing pitch.

Also, the above description has been made on a case where magneticfields are applied collectively to the individual cantilevers 2 formedon the SOI wafer 10 and thereafter the parylene layer 18 is formed sothat the posture of the cantilevers 2 is retained. However, theimpartment of the magnetic field and the retention of the posture mayalso be fulfilled individually for the cantilevers 2. Also, in thecantilevers 2, the impartment of the magnetic field may be suppressedfor those cantilevers whose movable portions 2 a do not need to bechanged in posture, such as the Z-axis direction cantilever 2Z. Further,cantilevers whose movable portions 2 a do not need to be changed inposture may be structured without providing the Cr/Ni layer itself. Thisis because adopting such a structure eliminates the need for individualcontrol for impartment/non-impartment of the magnetic field.Furthermore, the deformed angle, i.e. raised angle, may also be adjusteddepending on the area of the coverage with a magnetic material (Cr/Nilayer 15). Such a method makes it practicable to optimize the sensorangle or the like according to the use or purpose. In addition, theraised angle can be adjusted not only by the area but also by theposition where the magnetic material is formed, such as a forward end orcenter of the cantilevers.

The above description has been given with the tactile sensor 1 taken asan example of the three-dimensional structure. However, thethree-dimensional structure of the present invention is not limited onlyto such tactile sensors. The three-dimensional structure has only to beso structured that a plurality of micro three-dimensional structureelements typified by cantilevers 2 formed with a substrate of arelatively hard material such as Si or SiO₂ used as the sacrifice layerby MEMS or NEMS technology or the like are arranged within a film-likeelastic body, and thereafter the sacrifice layer is removed so that theindividual micro three-dimensional structure elements are arrangedindependently of one another within the film-like elastic body. Thethree-dimensional structure, only if it has such a structure as shownabove, can be manufactured by applying the manufacturing method of thefirst embodiment.

Such a micro three-dimensional structure element as shown above is astructure element which has a movable structure that at least part ofthe structure is movable, and that the structure element, as it isplaced within the film-like elastic body, is movable by action ofexternal force along with its surrounding elastic body. However, whenthe three-dimensional structure formed with such micro three-dimensionalstructure elements are embedded in the film-like elastic body is appliedfor uses without limitations to sensors or the like for detectingdeformation of the movable portion (movable structure), e.g., for suchuse as deformation of the movable portion is not involved as in thecases of integrated circuits and photosensors or the like, each of themicro three-dimensional structure elements may be one having no movablestructure, in which case the three-dimensional structure can bemanufactured by applying the manufacturing method of the presentinvention.

Further, the micro three-dimensional structure element is preferably hasan external force detection function of detecting an operation(deformation) of the movable structure based on elastic deformation(e.g., shearing stress) caused in the elastic body by the action ofexternal force on the three-dimensional structure. Instead, the microthree-dimensional structure element may have an external force transferfunction that the movable structure is operated (deformed) to makeexternal force transferred to its surrounding elastic body so that theelastic body is elastically deformed. The external force detectionfunction is typified by a function as a tactile sensor in the case of,for example, a cantilever, while the external force transfer function isa function that the film-like elastic body is partly elasticallydeformed by operating the cantilever at an actuator. Thus, if the microthree-dimensional structure element has the external force detectionfunction or external force transfer function, it becomes possible toindividually and reliably fulfill the function in a state that the microthree-dimensional structure elements are embedded within the film-likeelastic body independently of one another. In addition, thepiezoresistive layer (portion) in the cantilever may serve as anexternal force detector portion having such a function. Further, thecantilever may be set so as to serve as an external force transferportion. The functioning of the cantilever as the external forcetransfer portion can be fulfilled by additionally providing a mechanismfor operating the movable portion, e.g. a piezoelectric element, or byoperating the movable portion with a magnetic field applied thereto bymagnetic anisotropy. It is also possible that the cantilever is providedwith both the external force detection function and external forcetransfer function so that upon reception of external force by theexternal force detection function, information is transferred by theexternal force transfer function.

The three-dimensional structure is applicable not only for sensors oractuators as shown above, but also for integrated circuits, displays(organic EL) and the like. Such a tactile sensor as shown above isapplicable not only for use as a cutaneous sensor for robots, but alsofor uses as instrument probes for measuring the configuration of asurface of an article having a large area (in particular, having acurved-surface configuration) by bringing a film-like elastic body intocontact with the article surface, pointing devices for computer input,tablets, and input and output devices for implementation of virtualreality. Also, the three-dimensional structure can also be provided as atemperature sensor or an acceleration sensor in which microthree-dimensional structure elements having the movable structure aremade to function as structure elements for detecting temperature oracceleration. Further, a temperature compensating sensor can also beimplemented by integrally making up a sensor in which microthree-dimensional structure elements having a temperature detectionfunction and micro three-dimensional structure elements having otherfunctions are compositely provided and arranged within a film-likeelastic body.

Here is explained an example based on a simulation in which such atactile sensor 1 as shown above is applied as a cutaneous sensor placedon the surface of a robot hand.

First, in the simulation, resistance changes in the piezoresistive layer14 with respect to displacements of the movable portion 2 a of thecantilever 2 were measured by the manufactured tactile sensor 1. With ashearing force of 2.5 kPa weighted, a displacement ΔL is expressed bythe following equation:

$\begin{matrix}{{\Delta \; L} = {L \times {\tau/E}}} \\{= {500\mspace{11mu} {µm} \times 2.5\mspace{14mu} {{kPa}/800}\mspace{14mu} {kPa}}} \\{= {1.5\mspace{14mu} {µm}}}\end{matrix}$

where L is the length of the cantilever.

The resulting resistance change in this case is about 10Ω. Assuming thatthe measurement is limited to the 1Ω order due to an effect of noise orthe like in the resistance value detection, a theoretical lower-limitvalue of displacement detection determined by a resistance change isΔL=0.15 μm. It is noted that improvement in resistance detectionaccuracy makes it possible to measure even lower displacements.

Here is assumed, as an example, a case where a 1-liter PET-bottle isgrasped by a robot hand via a cutaneous sensor. Grasping the 1-literPET-bottle by hand necessitates a shearing force of (1 kg×9.8 m/s²)/98cm²=1 kPa (where the area of the palm is set to be 7 cm×14 cm). Adistribution of displacements with this shearing force weighted wascalculated by simulation. As a result, it was determined thatdisplacements equal to or higher than the detection lower-limit value ofdisplacement occur in a region within a distance of 0.7 cm from theweighting point.

From the above simulation result, it can be found that the detectability(sensitivity) of the cantilevers 2 is 0.7 cm or less, so that arrangingthe cantilevers 2 within the film-like elastic body 3 at a pitch of 1.4cm makes it possible to detect such a force as that for grasping aPET-bottle.

Also, in a calculation by a simulation based on the assumption that anobject weighing 100 g is grasped by a robot hand similarly, it can beunderstood that arranging the cantilevers 2 within the film-like elasticbody 3 at a pitch of 0.4 cm or less allows shearing force by the objectto be detected.

Although the arrangement interval (pitch) for the cantilevers can bedetermined by using a lower-limit value for displacement detection asshown above, yet it is preferable to determine the arrangement intervalfor the cantilevers in consideration of a thickness of the film-likeelastic body and Young's modulus of a material from which the film-likeelastic body is formed.

Although the structure of the terminal portion 4 in the cantilevers 2has been briefly explained in the above description, a structure of theterminal portion for more reliable functioning of the cantilevers is nowdescribed below with reference to FIG. 20, which shows a schematic topview of a cantilever 92 according to a modification of the firstembodiment, and FIG. 21, which is a sectional view of the cantilever 92taken along the line D-D in FIG. 20.

First, as shown in FIGS. 20 and 21, the cantilever 92 includes a movableportion 92 a, a fixation portion 92 b, and a hinge portion 92 c which isan example of a connecting portion that connects the movable portion 92a and the fixation portion 92 b to each other so as to allow the movableportion 92 a to operate. Also, the fixation portion 92 b has a terminalportion 94 to which a wiring line is to be connected, and a plated Culayer 96 is formed so as to cover the top face of the Cr/Ni layer 15 sothat the terminal portion 94 functions as an electrode portion.

Such a plated Cu layer 96 is higher in rigidity than the other layers,while the hinge portion 92 c having a deformation function is lower inrigidity. Accordingly, in the case of a structure in which thelow-rigidity hinge portion 92 c is connected directly to thehigh-rigidity fixation portion 92 b, i.e. terminal portion 94, thereoccurs thermal deformation due to plasma in the PDMS 19 provided aroundthe cantilevers during the process that the Si lower-layer 11 of the SOIwafer 10 is removed by DRIE etching process after the SOI wafer 10 withthe cantilevers formed thereon is embedded into the PDMS 19. In somecases, stress may be added to the hinge portions of the cantilevers, sothat the stress could concentrate at the connecting portion between thehinge portion and the terminal portion, resulting in damage of theconnecting portion. In order to prevent occurrence of damage due to thestress concentration to the connecting portion, contrivances shown beloware given to the cantilever 92.

As shown in FIGS. 20 and 21, at the terminal portion 94 of thecantilever 92, the plated Cu layer 96 is provided so as to cover theCr/Ni layer 15. However, at portions of the terminal portion 94corresponding to its connecting portion with the hinge portion 92 c andits peripheries, the plated Cu layer 96 is not provided but a hingeconnecting end portion 94 a where the Cr/Ni layer 15 is exposed isformed. Such a hinge connecting end portion 94 a is composed of thepiezoresistive layer 14, the Si upper-layer 13 and the Cr/Ni layer 15 asviewed in the thicknesswise direction, its rigidity in the thicknesswisedirection being set lower than that of the end portion 94 at portionswhere the plated Cu layer 96 is formed and higher than that of the hingeportion 92 c. That is, the rigidity of the connecting portion of thehinge portion 92 c to the end portion 94 is set so as to be middlebetween those of the two members. By such provision of the hingeconnecting end portion 94 a as shown above, the hinge connecting endportion 94 a is allowed to move together with the hinge portion 92 c tosome extent upon action of external force on the cantilever 92 so thatstress generated during the removal of the Si lower-layer 11 can bediffused. As shown in FIG. 20, the hinge connecting end portion 94 a isformed, for example, into a two-dimensional size of 275 μm×50 μm for thehinge portion 92 c having a two-dimensional size of 150 μm×30 μm. InFIG. 20, a portion represented by numeral 95 serves as an etching hole95 which is a space that allows the movable portion 92 a to bedisconnected from the Si lower-layer 11 so as to be operable.

Also, the three-dimensional structure is not limited only toplanar-shaped formations and, as shown in FIG. 11 as an example, may beformed or positioned in a curved-surface configuration. As shown in FIG.11, sacrifice layers 34 are formed in a hemispherical shell shape, and aplurality of micro three-dimensional structure elements 32 are formed soas to be arrayed on an outer peripheral surface of the hemisphericalshell. Then, by using the manufacturing method of the first embodimentor the like, a three-dimensional structure 31 can be formed in such afashion that those micro three-dimensional structure elements 32 arearranged within a film-like elastic body 33 which is similarly formedinto a hemispherical shell. Furthermore, the three-dimensional structurehaving a curved-surface configuration can be formed by using sacrificelayers having multifaceted-surface configuration. Such sacrifice layershaving the multifaceted-surface configuration can be formed by combininga plurality of small planar-shaped sacrifice layers, on which the microthree-dimensional structure elements 32 are arranged, each other.

As an example, in the case where the micro three-dimensional structureelements 32 are formed as cantilevers and the three-dimensionalstructure 31 is made up as tactile sensor, a curved-surface arrangementin close contact with the surface of a robot hand or the like can beachieved. With an application to such a curved-surface arrangement, itbecomes possible to more effectively obtain the working effects of thethree-dimensional structure by virtue of the first embodiment, whichadopts a technique of using a relatively hard layer such as the Silower-layer 11 or the SiO₂ layer 12 as a sacrifice layer and finallyremoving the layer. In addition, for the film-like elastic body 3 formedfrom PDMS having a thickness of, for example, 1 mm, a minimum radius ofwinding object is about 1.1 mm, so that the film-like elastic body 3 hasenough flexibility to make the arrangement in close contact with thesurface of the robot hand or the like.

Furthermore, as shown in FIG. 12, a base material such as so-calledlining may be provided on a bottom surface of a three-dimensionalstructure 41 of a curved-surface arrangement for more reliability of thearrangement. Such a base material is preferably a flexible one formedfrom a material which is harder than a film-like elastic body 43 to haveindividual micro three-dimensional structure elements 42 arranged insideand which is softer than SOI wafer or the like.

Also, although not shown, it is also possible that a plurality of Z-axisdirection cantilevers are arranged within an independent film-likeelastic body to make up a pressure sensor while a plurality of X-axisdirection cantilevers and Y-axis direction cantilevers are arrangedwithin another film-like elastic body to make up a tactile sensor sothat a sensor having a multilayer structure of those film-like elasticbodies is constituted. With a sensor formed in a multilayer structurelike this, the cantilevers can be arranged in higher density, so that ahigher-sensitivity sensor can be provided.

Next, with respect to such a tactile sensor as shown above, arrangementof wiring lines connected to the individual cantilevers or the like isdescribed below.

As shown in the schematic sectional view of FIG. 6, a wiring line 5 forimplementing input and output of electric signals is connected to theterminal portion 4 of each cantilever 2 in the tactile sensor 1.Meanwhile, such a wiring line 5 is placed so as to be finally embeddedin the film-like elastic body 3 together with the cantilever 2. However,in a case where external force is applied to the film-like elastic body3 for its elastic deformation, stress is added to the wiring line aswell, there is a possibility of causing disconnections or connectionfailures or the like depending on the size of the stress or the like.Means for preventing such disconnections of wiring lines or the like isdescribed below.

First, a schematic perspective view of a tactile sensor 51 according toa modification of the first embodiment is shown in FIG. 13. Also, aschematic sectional view taken along the line B-B of one cantilever 52in the tactile sensor 51 of FIG. 13 is shown in FIG. 14.

As shown in FIGS. 13 and 14, a wiring line 55 is connected to a terminalportion 54 of the cantilever 52, and the wiring line 55 is embedded in afilm-like elastic body 53 in a curved-line state, e.g., a spiralplacement state. By such placement of the wiring line 55 as shown above,the spiral portion serves as a wiring slack portion 55 a, thus allowingthe wiring line 55 to be given a structural elasticity function. As aresult, a stress applied to the wiring line 55 along with the elasticdeformation of the film-like elastic body 53 can be elastically absorbedby the wiring slack portion 55 a, so that occurrence of disconnectionsor the like can reliably be prevented. In addition, the configuration ofsuch wiring lines, although illustrated in a linear shape (a wire shape)in the figure, may also be foil-shaped ones in which a wiring pattern isformed (drawn) on a thin film of copper or other conductors. Morepreferably, the terminal portion 54 is plated so as to be enhanced instrength.

Another means for preventing disconnections is shown in a schematicsectional view of a cantilever 62 in a tactile sensor 61 according toanother modification in FIG. 15. More specifically, in this means, asshown in FIG. 15, a wiring hollow portion 66 is provided within afilm-like elastic body 63 so that a terminal portion 64 of thecantilever 62 and a wiring line 65 are prevented from making contactwith the film-like elastic body 63, by which stress is kept fromtransferring from the film-like elastic body 63 to the wiring line 65.This means is reliably prevented from occurrence of disconnections.

Next, in such a tactile sensor as shown above, a means for ensuringintegral operation of the movable portion and the film-like elastic bodythat is in contact with the movable portion in the cantilever embeddedin the film-like elastic body, i.e., a means for preventing relativemotion between the movable portion and its surrounding elastic body, isdescribed below.

As a tactile sensor according to a modification of the first embodiment,a tactile sensor 71 adopting a relative motion prevention means is shownas a schematic perspective view thereof is shown in FIG. 16, and aschematic sectional view of one cantilever 72 taken along the line C-Cin the tactile sensor 71 of FIG. 16 is shown in FIG. 17.

As shown in FIGS. 16 and 17, a plurality of protruding portions 72 c,which are an example of engaging portions, are provided on a surface ofa movable portion 72 a of the cantilever 72, where the protrudingportions 72 c are to be engaged with their surrounding film-like elasticbody 73 so that the integrity between the movable portion 72 a and itssurrounding film-like elastic body 73 is further improved. In such astate, as the film-like elastic body 73 is elastically deformed, theelastic deformation can reliably be transferred to the movable portion72 a while relative motion of the movable portion 72 a and itssurrounding film-like elastic body 73 is reliably prevented. Thus, thefunction as the tactile sensor 71 can be further enhanced. In addition,such protruding portions 72 c can also be said to be relativemotion-preventing protruding portions (engaging portions) in terms oftheir function. Further, although FIG. 17 shows a case where theprotruding portions 72 c are provided only on one surface of the movableportion 72 a of the cantilever 72, the protruding portions 72 c may alsobe provided on the other surface or on both surfaces.

Furthermore, as shown in the schematic view of FIG. 23, it is alsopossible to adopt a construction that other members are arranged on thesurface of a film-like elastic body 103. More specifically, in a tactilesensor 101 shown in FIG. 23, a stress concentration layer 104 is formedon the surface of the film-like elastic body 103 in which a plurality ofcantilevers 102 are embedded.

As shown in FIG. 23, the stress concentration layer 104 is formedintegrally from a surface layer portion 104 a which covers a surface ofthe film-like elastic body 103, and a plurality of column portions 104 bwhich is embedded protrusively inward of the film-like elastic body 103.Also, the stress concentration layer 104 is formed from an elasticmaterial higher in rigidity than the film-like elastic body 103. Theindividual cantilevers 102 are so arranged that their movable portionsare partly positioned between adjacently positioned column portions 104b, respectively.

By the provision of such a stress concentration layer 104, upon actionof shearing stress on the surface of the tactile sensor 101, theshearing stress concentratedly acts on the stress concentration layer104 formed from a material of relatively high rigidity, so that theindividual column portions 104 b and portions of the film-like elasticbody 103 positioned therebetween are subjected to the action of theshearing stress. As a result, operation of the movable portions isfacilitated in the individual cantilevers 102, so that the tactilesensor 101 can be improved in the sensitivity for detection of shearingstress.

According to the first embodiment, the tactile sensor 1 is manufacturedby arranging, within the film-like elastic body 3, a plurality ofcantilevers 2 formed on a relatively hard substrate such as the SOIwafer 10, and thereafter removing portions of the SOI wafer 10 that makeno cantilevers 2 as a sacrifice layer. Therefore, in the tactile sensor1, the individual cantilevers 2 can be set in a mutual independentarrangement state. Accordingly, upon action of external force on thefilm-like elastic body 3, partial shearing stress generated within thefilm-like elastic body 3 can reliably be transferred by operation anddeformation of the movable portion 2 a of a cantilever 2 placed at theportion, allowing an amount of the deformation to be reliably detectedby the cantilever 2. In particular, since the substrate member 503formed of Si or other relatively hard material, which would be presentin the conventional tactile sensor 501, is not present in the tactilesensor 1 of the first embodiment, a tactile sensor of a curved-surfacearrangement can be formed by using the flexibility function of thefilm-like elastic body 3. Further, the cantilevers 2 still can bemanufactured with high accuracy of their arrangement and configurationand with high efficiency without any impairment, comparable to theconventional example. Thus, it becomes practicable to detect force andstrain amounts with high accuracy and low cost, so that the applicationscope of the tactile sensor can be widened.

Second Embodiment

It is noted here that the present invention may be embodied in variousmodes without being limited to the foregoing embodiment. For instance,FIG. 18 is a schematic perspective view showing a tactile sensor 81which is an example of a three-dimensional structure according to asecond embodiment of the present invention.

As shown in FIG. 18, the tactile sensor 81 of the second embodiment hasa construction not that a plurality of micro three-dimensional structureelements typified by cantilevers as an example are arranged individualindependently within the film-like elastic body, but that a plurality ofmicro three-dimensional structure element groups, in each of which aplurality of micro three-dimensional structure elements are connected toone another by a coupling member, are arranged individually andindependently within a film-like elastic body. This second embodiment issimilar in constitution to the first embodiment except that ‘structureelements’ are replaced with ‘structure element groups’ as shown above.Therefore, only this constitutional difference will be described below.

Concretely, as shown in FIG. 18, in the tactile sensor 81, fourcantilevers 82 are fixed to a coupling member 85, which is a commonmember, by which a cantilever group 84, which is an example of the microthree-dimensional structure element group, is made up. Also, a pluralityof such cantilever groups 84 are arranged and embedded independently ofone another within a film-like elastic body 83.

Such a coupling member 85 as shown above is formed in such a size thatthe individual cantilevers 82 can be fixed thereto in an arrangementpreventive against their mutual interference in their operations. Thecoupling member 85 is preferably formed as small as possible as far asit is capable of fixing the cantilevers 82 as shown above. Also, thecoupling member 85 may be formed from Si or other like material, but itis preferably formed from resin material or metal material havingelasticity. This is because forming the coupling member 85 smallerwithin a necessary limitation and from a material having elasticitymakes it implementable to provide a more flexible tactile sensor 81without impairing the elasticity of the film-like elastic body 83.

However, the coupling member 85 also has a role of securely coupling thecantilevers 82 of one group to ensure the movabilities of thosecantilevers within the film-like elastic body 83. That is, the couplingmember 85 has a role of maintaining a relative movability relationbetween mutually adjoining cantilevers 82 in the cantilever group 84regardless of the elastic deformation of the film-like elastic body 83,in other words, a role of transferring shearing strain of the film-likeelastic body 83 to a motion of a movable portion 82 a of the cantileverwith high efficiency. From this point of view, the coupling member 85preferably has the highest possible rigidity.

As shown above, the coupling member 85 has to meet the requirements ofhaving such elasticity as not to impair the elasticity of the film-likeelastic body 83, as well as having high rigidity to improve theresponsivity as a sensor. Therefore, the material for forming thecoupling member 85 is preferably an elastic material having a modulus ofelasticity higher than that of the elastic material for forming thefilm-like elastic body 83. It is noted that “a modulus of elasticity” isa ratio of stress to strain. Therefore, such a material having highrigidity also has high modulus of elasticity. Such a coupling member 85is formed by, in the manufacturing process, subjecting part of the Silower-layer to metal masking process in the step of etching (e.g., DRIE)of the Si lower-layer placed on the rear face to protect themasking-processed part from the etching effect.

By the provision of the coupling member 85 in the tactile sensor 81 asin this second embodiment, effects of the Z-axis direction pressureapplied to X-axis and Y-axis direction cantilevers 82 can be reduced.Further, effects due to deformation of the film-like elastic body 83 canalso be reduced by bendability of the tactile sensor 81 itself or thelike.

Furthermore, such a tactile sensor 81 of this second embodiment as shownabove as well as the tactile sensor 1 of the first embodiment can bechanged for the place of their application depending on their respectivecharacteristics. For example, in sensors for use in robots or the like,the tactile sensor 81 of the second embodiment in which the couplingmember 85 is used can be applied to portions having a configuration ofless curved surfaces and small curvatures such as the trunk portion andthe arm portion or the like. Meanwhile, the tactile sensor 1 of thefirst embodiment, in which micro three-dimensional structures are placedsingly or arranged with high density, can be applied to portions havinga configuration of more curved surfaces and large curvatures such asfinger tips or the like.

It is to be noted that, by properly combining the arbitrary embodimentsof the aforementioned various embodiments, the effects possessed by themcan be produced.

Although the present invention has been fully described in connectionwith the preferred embodiments thereof with reference to theaccompanying drawings, it is to be noted that various changes andmodifications are apparent to those skilled in the art. Such changes andmodifications are to be understood as included within the scope of thepresent invention as defined by the appended claims unless they departtherefrom.

The entire disclosure of Japanese Patent Application No. 2006-012614filed on Jan. 20, 2006, including specification, claims, drawings, andsummary are incorporated herein by reference in its entirety.

1-7. (canceled)
 8. A three-dimensional structure manufacturing methodcomprising: arranging, into a film-like elastic body, a plurality ofmicro three-dimensional structure elements each having a movablestructure fixed on a sacrifice layer, and fixation portions of saidmicro three-dimensional structure elements fixed to said sacrificelayers; and removing said sacrifice layers so that said microthree-dimensional structure elements are arranged independently of oneanother within said film-like elastic body.
 9. The three-dimensionalstructure manufacturing method as defined in claim 8, wherein thearrangement of said individual micro three-dimensional structureelements into said film-like elastic body is fulfilled by arranging aplurality of micro three-dimensional structure element groups, in eachof which said plurality of micro three-dimensional structure elementsare coupled to one another by a coupling member, and said individualfixation portions of said sacrifice layers, at which said individualmicro three-dimensional structure element groups are fixed to saidsacrifice layers, into said film-like elastic body, and then saidsacrifice layers are removed, by which said individual microthree-dimensional structure element groups are arranged independently ofone another into said film-like elastic body.
 10. The three-dimensionalstructure manufacturing method as defined in claim 8, furthercomprising: after the removal of the sacrifice layers, placing anelastic body, which is formed from the same material as that of saidfilm-like elastic body, at portions of said film-like elastic body wheresaid sacrifice layers have been removed.
 11. The three-dimensionalstructure manufacturing method as defined in claim 8, wherein saidindividual micro three-dimensional structure elements are arranged intosaid film-like elastic body so that at least parts of said sacrificelayers are exposed from a surface of said film-like elastic body. 12.The three-dimensional structure manufacturing method as defined in claim8, wherein the arrangement of said individual micro three-dimensionalstructure elements into said film-like elastic body is fulfilled byarranging, into said film-like elastic body that is in a fluidizablestate, said individual micro three-dimensional structure elements andsaid fixation portions to said sacrifice layers, and then curing theelastic body in the resulting arrangement state.
 13. Thethree-dimensional structure manufacturing method as defined in claim 8,wherein said sacrifice layers are formed of Si or SiO₂.
 14. Thethree-dimensional structure manufacturing method as defined in claim 8,wherein said individual micro three-dimensional structure elementsformed on said sacrifice layer having a curved-surface configuration ora multifaceted-surface configuration are arranged into said film-likeelastic body having a curved-surface configuration or amultifaceted-surface configuration.
 15. The three-dimensional structuremanufacturing method as defined in claim 8, further comprising: afterthe removal of the sacrifice layers, placing a flexible substrate formedfrom an elastic material on a surface of said film-like elastic body onone side on which said sacrifice layers have been removed.
 16. Thethree-dimensional structure manufacturing method as defined in claim 10,further comprising: after the placement of the elastic body at theremoval portions of the sacrifice layer, placing a flexible substrateformed from an elastic material on a surface of said film-like elasticbody on one side thereof on which said elastic body has been placed.